德国Fraunhofer HHI的研究主题包括表面照明和波导集成光电二极管，在InP衬底上使用III-V半导体材料作为InGaAsP和InAlGaAs材料组成。HHI提供光电探测器设计、掩模组设计、外延晶片生长、晶片加工、抗反射涂层、高速光电表征和原型封装到具有高达数百GHz RF连接器的光纤尾纤模块中（65GHz/67GHz、100GHz、145GHz）。

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Our research topics include surface illuminated and waveguide-integrated photodiodes, using III-V semiconductors materials as InGaAsP and InAlGaAs material compositions on InP substrates. As services, we offer photodetector design, design of mask sets, epitaxial wafer growth, wafer processing, anti-refelction coating, high-speed optoelectronic characterization and prototype packaging into fiber-pigtailed modules with RF connectors up to several hundred GHz.

Photodetector Types:

• receiver photonic integrated circuits (PIC) with 90° optical hybrids, AWGs and SOAs

• high-speed waveguide integrated photodetectors

• high-power photodetectors

• surface illuminated (vertically) illuminated photodiodes

• uni-travelling carrier (UTC) photodiodes

• avalanche photodiodes (APD)

• single photon avalanche detector (SPAD)

• photodetector packaging

• co-integration with trans-impedance amplifiers (TIA)

• monolithic integration of HEMT traveling-wave amplifiers (TWA)

Applications应用:

• long-haul, inter- and intra-datacenter communication

• quantum communication

• sensing e.g. LiDAR or interrogator

• imaging

• microwave photonic

Space-qualified photodetectors fabricated at HHI are used for laser communication terminals by TESAT Spacecom. Meanwhile more than 9 satellites orbiting the earth with photodetectors from HHI inside.

We closely cooperated with the company II-VI COHERENT in commercializing the coherent photodetectors.

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