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Teledyne太赫兹肖特基二极管

Teledyne太赫兹肖特基二极管

太赫兹肖特基二极管，太赫兹混频器、倍频器、检波器应用。

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太赫兹肖特基二极管，太赫兹混频器、倍频器、检波器应用。

GaAs Millimeter Wave/Sub-Millimeter Wave Schottky Diodes

Teledyne Scientific Company offers a wide variety of millimeter-wave and submillimeter-wave planar airbridged Schottky diodes for applications in the 10 GHz to over 2.5 THz range.

Unique Diode Properties

  • Junction capacitance as low as 2fF allowing cutoff frequency >2THz

  • Very low parasitic capacitance < 9fF

  • Ultra low series resistance < 3Ω

  • Airbridged anode contact for low parasitic operation

  • Fully passivated by SiN

  • Flip chip and beamlead geometry

  • Space qualifiable construction

  • MMIC backend process available for integrated passives and vias

  • Unique gold stand-off platforms for ruggedness in flip-chip applications

GaAs Schottky Diode Products:

Single Type

Part Number (PDF)VF@ 1mA (mV)CJunctionCTotalVR @ -5uAGeometryChip Dimension (GaAs only)
 TSC-S-01020730-9501.1 fF18 fF-5V minFlipChip14 mil x 5.1 mil
TSC-S-02020730-8504.3 fF23 fF-5V minFlipChip14 mil x 5.1 mil
TSC-S-03020730-8509.8 fF30 fF-5V minFlipChip14 mil x 5.1 mil
TSC-S-04020650-80017 fF40 fF-5V minFlipChip14 mil x 5.1 mil
TSC-SB-01020730-9501.1 fF18 fF-5V minBeamlead14 mil x 5.1 mil
TSC-SB-02020700-8504.3 fF23 fF-5V minBeamlead14 mil x 5.1 mil
TSC-SB-03020700-8509.8 fF30 fF-5V minBeamlead14 mil x 5.1 mil
TSC-SB-04020650.80017 fF40 fF-5V minBeamlead14 mil x 5.1 mil

反向并联Antiparrallel

Part Number (PDF)VF@ 1mA (mV)CJunction*CTotal**VR @ -5uAGeometryChip Dimension (GaAs only)
TSC-AP-02020700-8504.3 fF23 f-5v minFlipChip14 mil x 5.1 mil
TSC-AP-03020700-8509.8 fF30 fF-5v minFlipChip14 mil x 5.1 mil
TSC-AP-04020650.80017 fF40 fF-5V minFlipChip14 mil x 5.1 mil
TSC-AP-02020700-8504.3 fF23 fF-5V minBeamlead14 mil x 5.1 mil
TSC-APB-03020700-8509.8 fF30 fF-5V minBeamlead14 mil x 5.1 mil
TSC-APB-04020650-80017 fF40 fF-5V minBeamlead14 mil x 5.1 mil

TEE Type

Part Number (PDF)VF@ 1mA (mV)CJunction*CTotal**VR @ -5uAGeometryChip Dimension
TSC-T-01025730-9501.1 fF18 fF-5V minFlipChip22.2 mil x 5.1 mil
TSC-T-02025700-8504.3 fF23 fF-5V minFlipChip22.2 mil x 5.1 mil

Inverted-TEE

Part Number (PDF)

VF@ 1mA (mV)

CJunction*

CTotal**

VR @ -5uA

Geometry

Chip Dimension


TSC-IT-01025730-9501.1 fFF-5V minFlipChip22.2 mil x 5.1 mil
TSC-IT-02025
04.3 fF23 fF-5V minFlipChip22.2 mil x 5.1 mil

Square Shapped Single

Part Number (PDF)VF@ 1mA (mV)CJunction*CTotal**VR @ -5uAGeometryChip Dimension
TSC-SSS-05425660-75023 fF64 fF-5V minFlipChip11.3 mil x 11.3 mil
TSC-SSS-06225660-75030 fF75 fF-5V minFlipChip11.3 mil x 11.3 mil
TSC-SSS-07025660-75039 fF87 fF-5V minFlipChip11.3 mil x 11.3 mil

Small Profile Single Antiparrallel

Part Number (PDF)VF@ 1mA (mV)CJunction*CTotal**VR @ -5uAGeometryChip Dimension
TSC-SS-0112730-9501.1 fF14 fF-5V minFlipChip-Single5.1 mil x 3 mil
TSC-SAP-0109700-8501.1 fF14 fF**-5V minFlipChip-Antiparrallel5.1 mil x 3 mil

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